Mushkin recently announced a radically new heatsink design for their top memory modules. They claim it offers greatly-improved thermal dissipation capabilities courtesy of a larger surface area, a new aero-efficient design and an advanced thermal adhesive. Check it out!
At first glance, I have to say I like what I see. It appears that the memory chips will have more breathing room, and if you have a memory cooler, it looks like that could have a great affect. Check out all the information at Rojak Pot!