OCZ Technology Enhances Certified Memory Portfolio and Unveils New AMD CrossFire(TM) Certified Modules with an Advanced Heat Pipe Cooling Solution
Sunnyvale, Calif.—May 14, 2007—OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the OCZ PC2-8500 AMD CrossFire(TM) Reaper HPC Edition. As some of the highest performing modules on the market, the PC2-8500 CrossFire features the exclusive OCZ CrossFire edition Reaper HPC heatsink for advanced component cooling.
Tested and qualified under AMD’s renowned certification program, the PC2-8500 CrossFire series not only meets a high standard of quality, but guarantees superior compatibly with CrossFire technology. Combined with AMD’s esteemed CrossFire technology, the OCZ PC2-8500 certified series unleashes the performance potential of the entire platform.
“OCZ’s Reaper series makes use of heat pipe technology to efficiently cool high performance modules passively,” said Jacky Huang, VP of Product Management, OCZ Technology Group. “By working closely with AMD we are pleased to introduce the latest addition to our Crossfire memory lineup, a special Crossfire Certified Reaper 1066Mhz dual channel kit that is optimized to deliver exceptional performance and stability when coupled with CrossFire platforms.”
“AMD is committed to pushing the limits of what gaming systems can do through technologies like CrossFire, and the new memory modules from OCZ are a perfect addition to any high-performance CrossFire system,” said Godfrey Cheng, director, platform technologies, AMD Graphics Product Group. “The new CrossFire-certified memory from OCZ ensures that gamers get the highest quality memory, with superior performance and superb compatibility for their CrossFire systems.”
AMD enthusiasts and system builders will love the customized look of the new Reaper kits; these modules are cooled with an exclusive AMD special Reaper HPC (Heat Pipe Conduit) heatspreader displaying AMD’s “CrossFire Certified” emblem. These unique DDR2-1066 modules feature the Reaper HPC (Heat Pipe Conduit) heatspreader which is engineered to deliver superior silent heat dissipation over traditional heatspreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through a compact aluminum fin array. By strategically guiding performance-robbing heat away from key memory components, the unique Reaper HPC design maximizes passive cooling to improve longevity and stability of the modules.
The first certified Reaper HPC memory product available will be 2GB (2x1024MB) dual channel kits optimized for the latest CrossFire platforms. Rated to run with 5-5-5 timings, these modules offer gamers an additional performance edge over conventional DDR2-1066 memory. The CrossFire Certified Reaper 2GB kit is the supreme solution for gamers seeking the advantages of increased reliability and bandwidth management from their memory. Each OCZ PC2-8500 CrossFire Reaper module is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
For more information on the PC2-8500 AMD CrossFire(TM) Reaper HPC Edition, please visit our product page here.
About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures innovative, high-performance memory and components that set industry standards. OCZ memory is the first choice for users needing high-reliability, ultra-high performance memory solutions. All of OCZ Technology Group’s products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at http://www.ocztechnology.com