OCZ Technology Unveils the PC2-9200 FlexXLC with Hybrid Cooling Solution

Sunnyvale, CA—November 20, 2006—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the OCZ PC2-9200 FlexXLC 2x1GB Kit, a revolutionary new memory solution that offers unprecedented speed, signal integrity, and thermal management. These new modules feature the new OCZ FlexXLC heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. As the World’s fastest DDR2, the PC2-9200, in combination with the innovative FlexXLC technology, is considerably the most ground-breaking and unique memory product existing today.

The latest generation of DDR2 modules by far exceeds the original projections of the DDR2 design triggering a need for amendments in the operating specifications. For example, operating voltage, originally defined as 1.8V, has increased to typically 2.1V or even higher to reach 1GHz+ frequencies. In the case of a DDR2 module running at 1200 MHz and 2.1V supply voltage, this entails that the power consumption increases many times over that of the same module running at 400 MHz and 1.8V supply voltage. Power consumption, in turn, directly translates into heat dissipation.

The extreme increase in power consumption without substantial changes in form factor increases the power and heat density, which requires serious countermeasures to maintain the thermal balance necessary for signal integrity and high performance.

Thanks to OCZ’s FlexXLC (Xtreme Liquid Convention) heat management solution, the OCZ PC2-9200 operates at extreme speeds of 1150MHz without the high temperatures that inhibit or damage the module’s ICs. The FlexXLC module was engineered with a unique “flexible” design which gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation.

“Water-cooling is more efficient than air cooling, yet standard memory kits are usually not available in off-the-shelf water-cooled configurations,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology Group. “The new OCZ FlexXLC series—featuring an exciting, novel hybrid water and air cooler based on OCZ’s embedded copper liquid injection system—pushes thermal management of memory modules one step further to keep up with the ever-increasing frequency demands. Moreover, the FlexXLC modules seamlessly co-migrate with any system upgrade to liquid cooling.”

Among these thermal management advantages, the PC2-9200 FlexXLC also implements a new 8-layer PCB with thermally conductive power and ground planes to guide heat away from the interconnects with the memory ICs. This facilitates less “crosstalk,” consequently enhancing the module’s total signal integrity. The blend of 8-layer PCB technology and the FlexXLC surface cooler truly offers a state-of-the-art design for the extremist.

The PC2-9200 FlexXLC modules are optimized for the latest cutting edge platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ’s line-up of premium memory, the PC2-9200 series is backed by a Lifetime Warranty and industry-leading technical support. Harnessing the achievement of leading-edge speed, high performance heat dissipation, and enhanced signal integrity, the unparalleled design of the OCZ PC2-9200 FlexXLC is a complete, all-encompassing solution certain to set a new benchmark in enthusiast memory.

For more information on the OCZ PC2-9200 FlexXLC Series, please visit our product page here.